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MicroJoin introduces the VTA 63 constant force weld head for low force high precision applications JOURNAL ARTICLE published 1 December 2000 in Microelectronics International |
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Alphasem's new Swissline 9002 FC/CSP die attach system JOURNAL ARTICLE published 1 December 1999 in Microelectronics International |
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Semiconductor manufacturers predict bright future for bare die JOURNAL ARTICLE published 1 December 2000 in Microelectronics International |
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Innos Ltd and The University of Southampton announce new technique for suppressing Boron Diffusion in Silicon-Germanium JOURNAL ARTICLE published 1 April 2005 in Microelectronics International |
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Experiments show lead-free pastes will give great results with 0201s JOURNAL ARTICLE published 1 September 2006 in Microelectronics International |
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Half-size SBC packs a full size punch JOURNAL ARTICLE published 31 July 2009 in Microelectronics International |
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Visiprise and HMS software announce merger agreement JOURNAL ARTICLE published January 2006 in Microelectronics International |
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Qualcomm Snapdragon 800 processor first to use TSMCs 28HPM advanced process technology JOURNAL ARTICLE published 26 July 2013 in Microelectronics International |
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Revolutionary K-Route placement-independent interconnect synthesis melds routing and optimisation for predictable convergence and best quality of results JOURNAL ARTICLE published 1 December 2005 in Microelectronics International |
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Amkor Technology nears qualification of environmentally friendly material alternatives for ball grid array packages JOURNAL ARTICLE published 1 August 2001 in Microelectronics International |
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Kulicke & Soffa and Amkor Technology announce flip chip technologies license JOURNAL ARTICLE published 1 August 2000 in Microelectronics International |
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Agilent test equipment to be used in new UMIST research centre JOURNAL ARTICLE published 1 April 2003 in Microelectronics International |
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Ocean Optics produces its fastest spectrometer yet JOURNAL ARTICLE published 18 April 2008 in Microelectronics International |
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Planar Microwave Engineering: A Practical Guide to Theory, Measurement and Circuits JOURNAL ARTICLE published 1 August 2005 in Microelectronics International |
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Reliability evaluation on SRG with full-bridge power converter considering thermal stress JOURNAL ARTICLE published 6 June 2023 in Microelectronics International |
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Effect of wire diameter and hook location on second bond failure modes JOURNAL ARTICLE published 5 January 2015 in Microelectronics International |
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Thermal and mechanical properties of sintered Ag layers for power module assembly JOURNAL ARTICLE published 5 January 2015 in Microelectronics International |
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Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes JOURNAL ARTICLE published 3 January 2017 in Microelectronics International |
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International diary JOURNAL ARTICLE published 1 December 2003 in Microelectronics International |
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International diary JOURNAL ARTICLE published 26 July 2013 in Microelectronics International |