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Vertical bridgman techniques to homogenize zinc composition of CdZnTe substrates

JOURNAL ARTICLE published September 1995 in Journal of Electronic Materials

Authors: T. S. Lee | S. B. Lee | J. M. Kim | J. S. Kim | S. H. Suh | J. H. Song | I. H. Park | S. U. Kim | M. J. Park

https://doi.org/10.1007/bf02653053 Actions

Metalorganic vapor phase epitaxial growth of all-AlGaAs visible (∼700 nm) vertical-cavity surface-emitting lasers on misoriented substrates

JOURNAL ARTICLE published October 1997 in Journal of Electronic Materials

Authors: H. Q. Hou | M. Hagerott Crawford | B. E. Hammons | R. J. Hickman

https://doi.org/10.1007/s11664-997-0010-2 Actions

Molecular-beam epitaxial growth of CdSexTe1−x on Si(211)

JOURNAL ARTICLE published July 2003 in Journal of Electronic Materials

Authors: Y. P. Chen | G. Brill | N. K. Dhar

https://doi.org/10.1007/s11664-003-0059-5 Actions

Influence of bias-temperature stressing on the electrical characteristics of SiOC:H film with Cu/TaN/Ta-gated capacitor

JOURNAL ARTICLE published July 2006 in Journal of Electronic Materials

Authors: Kou-Chiang Tsai | Wen-Fa Wu | Chuen-Guang Chao

https://doi.org/10.1007/s11664-006-0143-8 Actions

Synthesis and Characterization of Li-Modified AgTaO3

JOURNAL ARTICLE published September 2014 in Journal of Electronic Materials

Authors: Hidayat Ullah Khan | Yaseen Iqbal

https://doi.org/10.1007/s11664-014-3219-x Actions

Structural and Electrical Properties of Ta ax La(1−a)x O y Thin Films

JOURNAL ARTICLE published November 2014 in Journal of Electronic Materials

Authors: Zahra Khorshidi | Ali Bahari | Reza Gholipur

https://doi.org/10.1007/s11664-014-3353-5 Actions

First-Principles Study of Electronic Structure and Thermoelectric Properties of Ge-Doped Tin Clathrates

JOURNAL ARTICLE published June 2014 in Journal of Electronic Materials

Authors: K. Akai | K. Kishimoto | T. Koyanagi | Y. Kono | S. Yamamoto

https://doi.org/10.1007/s11664-013-2963-7 Actions

HTS and PCT Reliability of Chips and Flex Substrates Assembled Using a Thermosonic Flip-Chip Bonding Process

JOURNAL ARTICLE published September 2012 in Journal of Electronic Materials

Authors: Cheng-Li Chuang | Min-Yi Kang

https://doi.org/10.1007/s11664-012-2033-6 Actions

Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source

JOURNAL ARTICLE published January 2009 in Journal of Electronic Materials

Authors: Chih-ming Chen | Po-yuan Shih | Yi-wei Lin

https://doi.org/10.1007/s11664-008-0564-7 Actions

Foreword

JOURNAL ARTICLE published March 1992 in Journal of Electronic Materials

Authors: David Kisker

https://doi.org/10.1007/bf02660449 Actions

Influence of Cu content on compound formation near the chip side for the flip-chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump during aging

JOURNAL ARTICLE published September 2006 in Journal of Electronic Materials

Authors: Guh-Yaw Jang | Jeng-Gong Duh | Hideyuki Takahashi | Szu-Wei Lu | Jen-Chuan Chen

https://doi.org/10.1007/s11664-006-0229-3 Actions

Foreword

JOURNAL ARTICLE published November 2002 in Journal of Electronic Materials

Authors: Srinivas Chada | Darrel Frear | Sungho Jin | Sung K. Kang | C. Robert Kao | Martin Weiser

https://doi.org/10.1007/s11664-002-0001-2 Actions

Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique

JOURNAL ARTICLE published May 2005 in Journal of Electronic Materials

Authors: Takao Ishii | Shinji Aoyama

https://doi.org/10.1007/s11664-005-0076-7 Actions

Transient behavior of Hg1−xCdxTe film growth on 3° off-(100) CdTe substrates by chemical vapor transport

JOURNAL ARTICLE published July 1998 in Journal of Electronic Materials

Authors: Yu-Ru Ge | Heribert Wiedemeier

https://doi.org/10.1007/s11664-998-0115-2 Actions

A stabilized tantalum diffusion barrier for the gold metallization system

JOURNAL ARTICLE published February 1974 in Journal of Electronic Materials

Authors: Aristotelis Christou | Howard M. Day

https://doi.org/10.1007/bf02654544 Actions

The role of the insulator in determining 1/f noise in Hg1-xCdxTe integrating MIS devices

JOURNAL ARTICLE published August 1993 in Journal of Electronic Materials

Authors: José L. Meléndez | Jeff Beck

https://doi.org/10.1007/bf02817515 Actions

Study on the different procedures for debleeding of plastic dip

JOURNAL ARTICLE published November 1987 in Journal of Electronic Materials

Authors: S. Tay | S. L. Kerk | S. J. Hu

https://doi.org/10.1007/bf02655494 Actions

The effects of short-range order and natural microinhomogeneities on the FIR optical properties of CdxHg1−xTe

JOURNAL ARTICLE published June 1999 in Journal of Electronic Materials

Authors: M. I. Vasilevskiy | A. I. Belogorokhov | M. J. M. Gomes

https://doi.org/10.1007/s11664-999-0049-3 Actions

Optoelectrical Behavior of Ferroelectric Lithium Rubidium Sulfate Crystals

JOURNAL ARTICLE published November 2018 in Journal of Electronic Materials

Authors: F. A. Najar | G. B. Vakil | B. Want

https://doi.org/10.1007/s11664-018-6519-8 Actions

Investigation of high quality GaAs:In layers grown by liquid phase epitaxy

JOURNAL ARTICLE published November 1994 in Journal of Electronic Materials

Authors: M. Milanova | T. Cholakova | L. Bedikjan | N. Stanev

https://doi.org/10.1007/bf02649975 Actions
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