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Mechanical Characteristics of Thin Die/Wafers in Three-Dimensional Large-Scale Integrated Systems

Journal Article published Aug 2014 in IEEE Transactions on Semiconductor Manufacturing volume 27 issue 3 on pages 341 to 346

Research funded by NEDO ¿Development of Functionally Innovative 3D-Integrated Circuit (Dream Chip) Technology¿ project that is based on the Japanese Government's METI ¿IT Innovation Program¿ | Association of Super-Advanced Electronics Technologies

Authors: Murugesan Mariappan, Takafumi Fukushima, Jichoel C. Bea, Kang-Wook Lee, Mitsumasa Koyanagi