Chemical exploratory analysis of printed circuit board (PCB) using inductively coupled plasma optical emission spectrometry (ICP OES): data treatment and elements correlation

JOURNAL ARTICLE published 28 December 2020 in Detritus

Authors: Jeyne Castro | Rodrigues Pereira-Filho Edenir

Thermal Management of QFN 48 Package Attached to Different Multi-Layers of Printed Circuit Board Designs

PROCEEDINGS ARTICLE published 1 January 2003 in 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2

Authors: John Chia | Charles Yang

Netflix Prize Poses Poseidon-like Problem

DATASET published 29 January 2020 in Volume 34, Number 1, February 2007

Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method

PROCEEDINGS ARTICLE published 1 January 2007 in ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1

Authors: Wen Jei Yang | Takahiro Furukawa | Shuichi Torii

Integration of Printed Circuit Board (PCB) Interface to Quartz Crystal Microbalance (QCM) for Gas Adsorption Testbed

PROCEEDINGS ARTICLE published 29 October 2023 in Volume 12: Micro- and Nano-Systems Engineering and Packaging

Authors: Thi Kieu Ngan Pham | Matthew Nakamura | Joseph J. Brown

Printed Circuit Board Pad Crater Test Methods and Sample Design

PROCEEDINGS ARTICLE published 9 November 2012 in Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B

Authors: Todd Embree | Deassy Novita | Gary Long | Satish Parupalli

Design for Manufacturability: Cost Analysis of Electronic Circuit Board Assembly

PROCEEDINGS ARTICLE published 22 September 1991 in 17th Design Automation Conference: Volume 1 — Design Automation and Design Optimization

Authors: Charlie A. S. Heng | Robert K. L. Gay

Two-Level Nonlinear Mixed Discrete-Continuous Optimization-Based Design: An Application to Printed Circuit Board Assemblies

PROCEEDINGS ARTICLE published 13 September 1992 in 18th Design Automation Conference: Volume 1 — Optimum Design, Manufacturing Processes, and Concurrent Engineering

Authors: S. Praharaj | Shapour Azarm

Effect of Manufacturing Process Parameters on Property Evolution of Printed Circuit Board Laminates

PROCEEDINGS ARTICLE published 9 November 2012 in Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B

Authors: Pradeep Lall | Vikalp Narayan | Jim Blanche | Mark Strickland

Automated Design of Custom Printed Circuit Board Enclosures With Integrated Cooling Capabilities

PROCEEDINGS ARTICLE published 29 October 2023 in Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology

Authors: Felix Pancheri | Yilun Sun | Christoph August Wilhelm Parhofer | Christoph Rehekampff | Dingzhi Zhang | Tim C. Lueth

Development of tunnel drainage system using drain board

BOOK CHAPTER published 11 May 2007 in Underground Space - The 4th Dimension of Metropolises, Three Volume Set +CD-ROM

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

PROCEEDINGS ARTICLE published 1 January 2011 in ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2

Authors: Tomoyuki Hatakeyama | Masaru Ishizuka | Shinji Nakagawa | Sadakazu Takakuwa

Largest transportation system – Metro and road in the same tunnel

BOOK CHAPTER published 11 May 2007 in Underground Space - The 4th Dimension of Metropolises, Three Volume Set +CD-ROM

La charte de l'Ordre de 1961. Ses activités. Les principes qui les guident. Le nombre des membres de l'Ordre et l'effectif de ses groupements auxiliaires. Le financement des activités de l'Ordre

BOOK CHAPTER published in Recueil des Cours, Collected Courses, Volume 163 (2007)